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US Patent Number

6103403

Publication Date

8-15-2000

Abstract

A method including the steps of (a) depositing a metal layer on a selected portion of a silicon substrate under a first set of predetermined conditions to form an metal silicide layer and an intermediate n-type silicon layer; and (b) exposing the metal silicide layer and the n-type silicon layer to a second set of predetermined conditions to form a silicon clathrate film on the selected portion of the silicon substrate, where the intermediate n-type silicon layer acts to bond the silicon clathrate to the silicon substrate to form a silicon clathrate structure.

Assignees

University of Kentucky Research Foundation Intellectual Property Development, Lexington, Ky.

Application Number

08/856,750

Filing Date

05/15/1997

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