US Patent Number
6852369
Publication Date
2-8-2005
Abstract
Methods for preventing dissolution of solid substrates, such as metal leaching from coal or corrosion of metal surfaces, are provided.
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Assignees
University of Kentucky Research Foundation, Lexington, KY (US)
Application Number
10/656,569
Filing Date
09/05/2003
Recommended Citation
Atwood, David A., "Method for Prevention of Solid Dissolution Through Covalent Ligand Bonding" (2005). Chemistry Faculty Patents. 34.
https://uknowledge.uky.edu/chemistry_patents/34
