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US Patent Number
6852369
Publication Date
2-8-2005
Abstract
Methods for preventing dissolution of solid substrates, such as metal leaching from coal or corrosion of metal surfaces, are provided.
To read the remainder of this abstract, please download this patent.
Assignees
University of Kentucky Research Foundation, Lexington, KY (US)
Application Number
10/656,569
Filing Date
09/05/2003
Recommended Citation
Atwood, David A., "Method for Prevention of Solid Dissolution Through Covalent Ligand Bonding" (2005). Chemistry Faculty Patents. 34.
https://uknowledge.uky.edu/chemistry_patents/34
