Author ORCID Identifier
Year of Publication
Doctor of Philosophy (PhD)
Dr. Hailong Chen
Dr. Jonathan Wenk
Peridynamic material correspondence model is able to incorporate material constitutive models directly from classical continuum mechanics theory. However, conventional correspondence model faces two major technical issues for its application to practical problems. The first is the material instability, which results severe oscillations in the predicted displacement fields. The second issue is the length scale effects of materials mechanical behavior at low length scales. This research journey mainly consists of three stages. The first two stages of this research journey focus on the development of the bond-associated peridynamic material correspondence model to inherently remove the material instability. The last stage focuses the development of the higher-order peridynamic material correspondence model to capture length scale effect at low length scale. In this paper, a reformulation of the bond-associated correspondence model was proposed. Detailed studies on the wave dispersion relations, static deformation problems support that the reformulation significantly improves the material stability of the original bond-associated correspondence model. In addition, A numerical study of the higher-order peridynamic material correspondence model is conducted to verify the material stability and show the capability of the higher-order formulation in capturing the length scale effect in materials accurately.
Digital Object Identifier (DOI)
Chan, WaiLam, "Peridynamic Material Correspondence Models: Bond-Associated and Higher-Order Formulations" (2022). Theses and Dissertations--Mechanical Engineering. 206.