High-quality HfO2 cannot be grown directly on Si substrate using atomic layer deposition (ALD), and an interfacial oxide layer is needed. Traditionally, interfacial oxide layer is formed either in SC1 solution (2 NH4OH: 4 H2O2: 200 H2O) or by ozonated water spraying. A highly hydrophilic SiO2 interfacial layer was in-situ formed in the ALD chamber using 1 cycle of ozone and water. The HfO2 deposited on this interfacial layer showed great growth linearity. The gate leakage current is comparable to that formed using chemical oxide as the interfacial layer. The capacitance-voltage (C-V) curves have negligible frequency dispersion and hysteresis, which suggest high quality in both the interface and electrical properties. The in-situ formation of hydrophilic interfacial layer have advantages over the traditional interfacial layer. This might be useful for formation of interfacial layer on sophisticated 3-D MOS structures such as FinFETs and nanowire FETs. In addition, the chemical oxidation step can be eliminated from the integrated circuits manufacturing processes, which is economically beneficial to the industry.

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Published in ECS Journal of Solid State Science and Technology, v. 3, issue 12, p. N155-N160.

© The Author(s) 2014. Published by ECS.

This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY, http://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse of the work in any medium, provided the original work is properly cited.

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This research was supported by University of Kentucky Research Support Grant, and was partially supported by the National Science Fundation EPSCoR Grant 0814194.