In order to enable more widespread implementation of sophisticated process modeling, a novel, rapidly deployable multi-physics hybrid model of surface integrity in finishing operations is proposed. Rather than modeling detailed chip formation mechanics, as is common in numerical models, the proposed models integrates existing analytical and semi-empirical models of the plastic, elastic, thermal and thermodynamic domains. Using this approach, highly complex surface integrity phenomena such as residual stresses, grain size, phase composition, microhardness profile, etc. can be accurately predicted in a manner of seconds. It is envisioned that this highly efficient modeling scheme will drive new innovations in surface engineering.

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Conference Proceeding

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Published in Procedia CIRP, v. 82.

© 2019 The Author(s)

Under a Creative Commons license

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